EPICURE will be present at the upcoming IMAPS Italy Workshop – “High Reliability Packaging for Avionics, Aerospace & Defense”, taking place on 3 November 2026 at the Polytechnic University of Milan – Bovisa. Our consortium partner Leonardo S.p.A. will be represented by Ferdinando Ricci, who will contribute to the workshop with the presentation: “Ku-band Up/Down…
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EPICURE Consortium had a great meeting in Berlin at the Fraunhofer IZM premises, where cutting-edge research in microelectronics and advanced packaging technologies is shaping the future of innovation, with the possibility of having a lab tour. It was a valuable opportunity to align in person, exchange ideas, and strengthen collaboration. We’re happy to share that…
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State of the art high performance electronics are at the heart of nearly all defense products. However, the specificities of these products do not allow a straightforward use of civilian electronics. Therefore, mastering advanced packaging technologies and architectures is pivotal to produce world-class defense products. New trends in integration beyond Moore law are based on…
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Project EPICURE has officially started! From December 2023 and over the next four years, the Consortium aims to pioneer innovative solutions in advanced packaging for defence needs. Stay tuned for updates on our journey!