The EPICURE team recently came together in Gennevilliers, France, for an engaging and productive project meeting. This gathering provided an excellent opportunity for partners to discuss the latest project updates, review progress achieved so far, and align on the next phases of work. Throughout the meeting, team members exchanged ideas, shared experiences, and worked collaboratively…
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EPICURE Consortium had a great meeting in Berlin at the Fraunhofer IZM premises, where cutting-edge research in microelectronics and advanced packaging technologies is shaping the future of innovation, with the possibility of having a lab tour. It was a valuable opportunity to align in person, exchange ideas, and strengthen collaboration. We’re happy to share that…
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We recently had the pleasure of meeting at Thales site in Toulouse, France, where our teams came together to align on the next steps of EPICURE project. It was an energizing and productive session, full of fresh ideas and shared ambition. After the meeting, we toured the Synergie-CAD lab inside Thales premises, to gain a…
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EPICURE Partners met at Thales premises in Paris. State Of the Art in Advanced Packaging Technologies is available together with the System-in-Package components requirement for use in the application field part of the project scope. This allowed moving forward with identifying the packaging technological bricks to be studied. The Architecture of the targeted high-speed interfaces…
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The team behind EPICURE project recently gathered for a highly productive meeting, reaffirming our shared commitment to collaboration and excellence. It provided an opportunity to review the milestones achieved to date, exchange updates, and align on the next steps ahead. Our discussions highlighted the dedication of all partners and the steady progress toward the project’s…
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State of the art high performance electronics are at the heart of nearly all defense products. However, the specificities of these products do not allow a straightforward use of civilian electronics. Therefore, mastering advanced packaging technologies and architectures is pivotal to produce world-class defense products. New trends in integration beyond Moore law are based on…
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