Project EPICURE aims to develop Outsourced Semiconductor Assembly and Test services (OSAT) and support technology providers in Europe in the field of advanced packaging serving defence needs.
The project will analyse use-cases requirements and constraints and combine these towards modular architectures based on future chiplets. Five technology demonstrators will be designed, manufactured and tested to prequalify a “packaging toolbox” that will be built during the project.
EPICURE is funded by the European Union: European Defence Fund (EDF) 2022
Project Progress and Results
Latest News, Communication and Events
Meeting Paris
The EPICURE team recently came together in Gennevilliers, France, for an engaging and productive project meeting. This gathering provided an excellent opportunity for partners to discuss the latest project updates,[…]
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Meeting Berlin
EPICURE Consortium had a great meeting in Berlin at the Fraunhofer IZM premises, where cutting-edge research in microelectronics and advanced packaging technologies is shaping the future of innovation, with the[…]
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Meeting Toulouse & Visit of Synergie-CAD lab
We recently had the pleasure of meeting at Thales site in Toulouse, France, where our teams came together to align on the next steps of EPICURE project. It was an[…]
Read moreThe Consortium
Our consortium comprises 17 companies and 2 universities from 6 different European countries
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