Project EPICURE aims to develop Outsourced Semiconductor Assembly and Test services (OSAT) and support technology providers in Europe in the field of advanced packaging serving defence needs.
The project will analyse use-cases requirements and constraints and combine these towards modular architectures based on future chiplets. Five technology demonstrators will be designed, manufactured and tested to prequalify a “packaging toolbox” that will be built during the project.
EPICURE is funded by the European Union: European Defence Fund (EDF) 2022
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Project Kick-off!
Project EPICURE has officially started! From December 2023 and over the next four years, the Consortium aims to pioneer innovative solutions in advanced packaging for defence needs. Stay tuned for[…]
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Our consortium comprises 17 companies and 2 universities from 6 different European countries
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