EPICURE at the IMAPS Italy Workshop 2026

EPICURE will be present at the upcoming IMAPS Italy Workshop – “High Reliability Packaging for Avionics, Aerospace & Defense”, taking place on 3 November 2026 at the Polytechnic University of Milan – Bovisa.

Our consortium partner Leonardo S.p.A. will be represented by Ferdinando Ricci, who will contribute to the workshop with the presentation:

“Ku-band Up/Down Converter Module with 3D Package on Package Architecture”

The workshop will bring together experts from industry, research and the semiconductor ecosystem to discuss advanced packaging technologies and high-reliability solutions for avionics, aerospace and defence applications — topics closely connected with the technological challenges addressed by EPICURE.

We are glad to see EPICURE represented within the advanced packaging community and look forward to an interesting day of knowledge exchange and discussion.

More Info at: https://www.imaps-italy.it/news-eventi/in-primo-piano/november-3rd-high-reliability-packaging-for-avionics-aerospace-defense.html