EPICURE at the Summer School on Advanced Packaging in Eindhoven • Eindhoven University of Technology, The Netherlands
The first edition of the Summer School on Advanced Packaging for Wireless, Microwave & Photonics Systems was recently held at Eindhoven University of Technology, bringing together more than 30 participants and experts from academia and industry to discuss the latest developments in advanced packaging technologies.
The Summer School, held from 25 to 28 August 2026, focused on advanced packaging solutions for wireless, microwave and photonic systems and featured contributions from several experts in the field.
Among the speakers several EPICURE Partners presented the current state of the art in the field and highlighted EPICURE as one of the initiatives working beyond today’s state of the art, connecting the topics discussed during the School with the technological challenges currently being addressed by the project.
Although no specific EPICURE results were presented, the occasion provided another valuable opportunity to raise awareness of the project within the advanced packaging community and to highlight its contribution to the development of future European packaging technologies.
We are pleased to see EPICURE represented in initiatives that foster knowledge exchange between researchers, industry and the next generation of experts in advanced packaging.