Workshop 18-19 March 2024
The team behind EPICURE project recently gathered for a highly productive meeting, reaffirming our shared commitment to collaboration and excellence. It provided an opportunity to review the milestones achieved to date, exchange updates, and align on the next steps ahead.
Our discussions highlighted the dedication of all partners and the steady progress toward the project’s objectives. By bringing together expertise from across Europe, the consortium continues to deliver meaningful results while fostering innovation and cooperation.
With this strong foundation in place, we are confident that the momentum will carry forward. All partners remain fully engaged and committed to realizing the ambitious goals of the initiative. Together, we look forward to advancing into the next phases of our work and to sharing further outcomes with our stakeholders and community.
The onsite technical workshop, the 18th/19th of March 2024, gathering 43 attendees, allowed most of the contributors to meet face to face, share progress and clarify/readjust the content/inputs/outputs of WP2-3-4-6.
The project is organised into six technical work packages (WPs) and two for the global management, the dissemination and exploitation.
The technical work packages are organised into three phases quite close to a traditional engineering V-scheme combined with maturity ramp-up model:
- Definition phase:
- State of the art of Advanced Packaging in WP2,
- Specifications of System-in-Package for each targeted applications and all relevant information for its packaging definition in WP3.
- Implementation:
- Packaging technological building block development in WP4,
- Chiplet Integration including physical and logical interfaces in WP5,
- Product Development toolbox and SiP engineering design flow in WP6.
- Verification:
- Demonstrator manufacturing and evaluation in WP7.
WP1, WP2, WP3, WP4, WP5 and WP8 kick off happened after EPICURE T0 date, the 1st of December 2023.
Regular progress and technical meetings between contributors are in place from there.
Project Governance to monitor the project is in effect now.
It includes Documentation management, Project Plan and risks management, reporting principle, contacts list, Project Management Team and Project Steering Committee members.
WP2 is in progress with internet research, reviews of scientific literature and publication, patent and data sheets in both defence and consumer electronics domains.
Working documents are capturing initial results of the state of the art in components, advance packaging technologies, high-speed interface standardization and advance packaging design tools.
WP3 is running with System-in-Package specification considering four different application fields. Now, Defence System partners and technology providers are studying future system needs, corresponding SiP architecture and functional decomposition and related packaging technology requirements.
A first draft of System-in-Package specification is available for internal to consortium review.
WP4 is just starting with technological bricks specification. There is a close collaboration in place with WP3 and at this moment, contributors are working on clarifying the components and dies the technological bricks will integrate.
The work is ongoing.
WP5 is under way with Functional analysis of UCIe and XSR Serdes Physical Layers based on the standards specifications. There is a collaboration in place with WP3 to get clarification on Chiplet IF interface needs.
The work is ongoing. Technical presentations are capturing the essentials and options of both UCIe and XSR Serdes interfaces.
WP8 is in progress with dissemination and exploitation. The main achievement is the creation of a website.