What is EPICURE?
State of the art high performance electronics are at the heart of nearly all defense products. However, the specificities of these products do not allow a straightforward use of civilian electronics. Therefore, mastering advanced packaging technologies and architectures is pivotal to produce world-class defense products.
New trends in integration beyond Moore law are based on Heterogeneous Integration and Advanced Packaging. The EDA SIPSUPC and DG DEFIS Delphi studies have confirmed the need to develop advanced packaging technologies and shared OSATs (Outsources Semiconductor Assembly and Test services) in Europe, as the most advanced technologies are located in Far East or in US and are not accessible or under usage restriction.
EPICURE aims at giving Europe the means to master its future in advanced packaging in defense.
EPICURE will generate and integrate knowledge in advanced packaging technologies and architectures, will perform the related studies and designs and will prepare the supply chains to offer integration solutions compatible with severe defense constraints and low volume production
The project will analyse use cases requirements and constraints, and combine these towards modular architecture based on future chiplets.
Elementary technological bricks such as advanced substrate down to 15µm L/S, wafer level packaging, Die to Die interconnect IP will be developed and tested to build a “packaging toolbox”.
Design engineering concerns will also be addressed to identify the design flow, the design and assembly rules to build a “Physical Design Kit”.
Five technology demonstrators will validate the technical objectives of the targeted use cases.
Nine Defense System partners in Epicure bring the several demanding applications that drive the requirements for advanced packaging technologies and shared supply chain. Objectives are to integrate more in a ratio 2 to 2.5 time more compact, to enable a full RF Transceiver for Digital Beamforming within the frequency array pitch, a wide band RF Sensor, a very compact Digital System on Module such for Modem or Hardware Cyber-secure Module.
The aim is to develop in Europe OSAT and technology providers in the field of advanced packaging serving defence needs. These ambitious goals are achievable because the partners will bring advanced technologies and process, i.e. advanced wafer level packaging from IZM, die-to-die interconnect from Extoll, new interposer for RF from UMS, heterogeneous integration packaging and test from Synergie CAD plus others.