Project EPICURE aims to develop Outsourced Semiconductor Assembly and Test services (OSAT) and support technology providers in Europe in the field of advanced packaging serving defence needs.
The project will analyse use-cases requirements and constraints and combine these towards modular architectures based on future chiplets. Five technology demonstrators will be designed, manufactured and tested to prequalify a “packaging toolbox” that will be built during the project.
EPICURE is funded by the European Union: European Defence Fund (EDF) 2022
Latest News, Communication and Events
Meeting Toulouse & Visit of Synergie-CAD lab
We recently had the pleasure of meeting at Thales site in Toulouse, France, where our teams came together to align on the next steps of EPICURE project. It was an[…]
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Meeting December 2024
EPICURE Partners met at Thales premises in Paris. State Of the Art in Advanced Packaging Technologies is available together with the System-in-Package components requirement for use in the application field[…]
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Workshop 18-19 March 2024
The team behind EPICURE project recently gathered for a highly productive meeting, reaffirming our shared commitment to collaboration and excellence. It provided an opportunity to review the milestones achieved to[…]
Read moreThe Consortium
Our consortium comprises 17 companies and 2 universities from 6 different European countries
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